Welcome to the resource topic for 2024/1423
Title:
Towards package opening detection at power-up by monitoring thermal dissipation
Authors: Julien Toulemont, Geoffrey Chancel, Fréderick Mailly, Philippe Maurine, Pascal Nouet
Abstract:Among the various threats to secure ICs, many are semi-invasive in the sense that their application requires the removal of the package to gain access to either the front or back of the target IC. Despite this stringent application requirements, little attention is paid to embedded techniques aiming at checking the package’s integrity. This paper explores the feasibility of verifying the package integrity of microcontrollers by examining their thermal dissipation capability.
ePrint: https://eprint.iacr.org/2024/1423
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