Welcome to the resource topic for 2003/202
Title:
Yet Another Sieving Device
Authors: Willi Geiselmann, Rainer Steinwandt
Abstract:A compact mesh architecture for supporting the relation collection step of the number field sieve is described. Differing from TWIRL, only isolated chips without inter-chip communication are used. According to a preliminary analysis for 768-bit numbers, with a 130 nm process one mesh-based device fits on a single chip of ca. (4.9 cm)^2 - the largest proposed chips in the TWIRL cluster for 768-bit occupy ca. (6.7 cm)^2.
A 300 mm silicon wafer filled with the mesh-based devices is about 6.3 times slower than a wafer with TWIRL clusters, but due to the moderate chip size, lack of inter-chip communication, and the comparatively regular structure, from a practical point of view the mesh-based approach might be as attractive as TWIRL.
ePrint: https://eprint.iacr.org/2003/202
See all topics related to this paper.
Feel free to post resources that are related to this paper below.
Example resources include: implementations, explanation materials, talks, slides, links to previous discussions on other websites.
For more information, see the rules for Resource Topics .